Since the 1980s, cutting-edge lithography has shifted from the 365 nm 'i-line' of mercury vapour lamps to deep-ultraviolet light from excimer lasers at 248 nm (krypton fluoride lasers) and 193 nm ...

One of the most complex parts of this process is lithography: the step in which shapes are drawn onto a silicon wafer. There are several ways to do this, all of them rather complicated ...

An image of a mask containing the structure of an integrated circuit (IC) is projected onto a silicon wafer, which is coated with a light-sensitive ... Interestingly, DUV lithography at a ...

The challenge faced by the semiconductor industry is that current photolithography tools are constrained to transfer patterns with feature sizes larger than the "diffraction limit" which is roughly ...