Well-formulated solder pastes and tuned reflow profiles can yield excellent results in air, particularly when cosmetic appearance isn’t a driving factor. If the assembly uses standard-pitch components ...

Based on bump composition and structure as well as the reflow process used, various defects such as wicking, voids, poor wetting, flaking, crack, surface roughness, and intermetallic compound (IMC) ...

A glass-tube-based MT-style fiber array ferrule is presented that provides a compact interface to PIC (Photonic Integrated Circuit) edge waveguides. The approach aligns and attaches a glass ferrule on ...