Lightmatter announced a strategic partnership with Amkor Technology to create the largest-ever 3D-packaged chip complex utilizing Lightmatter's innovative Passage™ platform. ... We search for industry ...

ST has introduced 40V STripFET F8 MOSFETs with standard threshold voltage (VGS(th)), combining the advantages of the enhanced trench gate technology with superior noise ... ST has introduced an ...

Ironwood is now producing elastomer sockets which include a protective “P” layer that allows for more insertions by protecting the elastomer from erosion and debris build ... To characterize the IC ...

Wise-integration announced the opening of its North American Design & Development Center in Ottawa, Ontario, Canada. Led by Christian Cojocaru and staffed by experts ...

$1,000 is the figure to keep in mind to visualize the key role of semiconductor technologies within the automotive industry in 2029. Yole Group's analysts announce a $100 billion ... Semiconductor ...

Developed for medical device applications, Master Bond EP21LSCL-2Med is a two component non-cytotoxic epoxy for bonding, sealing, coating and potting. While most if not all epoxies ... Master Bond ...

Tresky Automation is pleased to announce the latest addition to its machine park in the field of contract manufacturing. Customers will now benefit from a state-of-the-art ... In the dynamic world of ...

Renesas Electronics Corporation announced the world's first “"8-in-1" proof of concept* (PoC) for E-Axle systems for electric vehicles (EV), which controls eight functions ... Semiconductor Packaging ...

Back-end equipment spending has always been in the range of 1% of the total semiconductor industry revenue, confirms Yole Group. Hence, the back-end segment is expected ... Semiconductor Packaging ...

ST has introduced an IO-Link reference design for industrial beacons and home-appliance alarms, delivered ready-to-use as a fully built board complete with protocol stack ... ST's STSPIN32 drivers ...

The IEEE Electronic Components and Technology Conference (ECTC), the premier technical conference and product exhibition for the world's semiconductor packaging ... The world’s leading forum for ...

ST has introduced an IO-Link reference design for industrial beacons and home-appliance alarms, delivered ready-to-use as a fully built board complete with protocol stack ... ST's STSPIN32 drivers ...